E-tec Interconnect
About E-tec
E-tec Interconnect is a specialist manufacturer of precision interconnection products used across a wide range of electronic systems. The company has roots in Swiss engineering dating back to 1973 and today supplies both standard and custom connectors, sockets, adapters and cable assemblies from its facilities in Europe and Asia.
What E-tec Make
E-tec’s portfolio is all about connecting components and systems reliably. Its core products include:
- Connectors: Board-to-board, wire-to-board, box headers, pin headers and specialised PCB interconnects, covering pitches from fine 0.30mm upwards.
- Sockets: Precision IC sockets, burn-in sockets and test sockets for programming and quality assurance in production.
- I/O and RF Connectors: D-Sub, USB, Mini-DIN and RF/coax connectors for signal-rich interconnection needs.
- Adapters: Package and footprint adapters that help engineers overcome chip obsolescence or prototype challenges.
- Cable Assemblies and Harnesses: Custom cables, including flat-flex and automotive-grade interconnects.
These products are available as standard catalogue items or tailored to specific project requirements, with E-tec supporting fast prototype runs through large-volume production.
Applications & Industries
E-tec parts are used in systems where reliable electrical and signal connection is critical:
- Automotive and EV: High-precision connectors and cable assemblies for automotive electronics, including electrical vehicle charging and powertrain interfaces.
- Aerospace and Defence: Rugged connectors and sockets designed for high-reliability systems in avionics and defence electronics.
- Medical and Test Equipment: Test sockets and interconnects for diagnostic devices, imaging gear and burn-in test systems.
- Communications and Computing: I/O connectors and board interconnects in networking, computing and industrial automation
E-tec’s range gives designers flexibility in board layout, signal integrity and mechanical connection, making it a good choice for engineers facing complex interconnection challenges.